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BGA100測試座採用的是彈片式OPEN-TOP結構，可用於自動機台和手動測試和燒錄BGA100字庫芯片，測試座的參數：.Open top,Zero Insertion Force designed for automatic loading
.Highly reliable,dual pinch , pre-loaded contacts
.For 0.50mm pitch packages
.Thru hole design
. Socket Body : PES,PEI
. Contact : Beryllium Copper Alloy
. Contact Plating : Gold over Nickel
. Contact Force:18g Per Pin (Normal)
. Operation Force 0.9 Kg MAX
. Contact Resistance:30mΩ Max , at 10mA and
同時我司有BGA100的翻蓋燒錄座，採用探針式結構，使用壽命10萬次，歡迎咨詢

20mV Max ( Initial)
. Insulation Resistance:1000mΩ Min . At DC 500V
. DielectricWithstanding Voltage For 1 Minute At AC 700V
. Operation Temperature: - 55℃~+175 ℃
. Life Span 15,000 Times ( Mechanical )