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霧化成型，金屬球成型機，直徑0.1mm以上。
 

pray forming uniform particles generated is to use the principle of mechanical vibration to be improved, because the fate of droplets in the process of consolidation is inevitable there will be some particles phenomenon.

When the liquid is viscous liquid shoot the ball, some small disturbance will cause the particles under the action of surface tension into small balls the process of contraction, which affects the relative single ball velocity, resulting in the merger between the small ball phenomenon.

In order to reduce particles in the fate of the merger process, group research Wei's technical team is in the system by adding a very stable micro-static devices, the fate of particles due to static electricity generated while the mutually exclusive, to avoid the compound.
 

At present, the aerosol particles forming devices to uniform way of producing BGA solder ball of the study, the domestic patented invention are the technical group of Wei-Leader. Wei Qun more in the next generation of design-oriented, the device equipped with timely monitoring system, which can detect the process of shooting the ball breaking through a certain amount of computer analysis software, you can shoot the ball on the process of producing an appropriate control, through such uniform particles monitoring the production, manufacture of solder ball surface quality and internal organization are extremely superior, Wei's technology group has successfully applied this theory to produce packaging using solder balls. And addressing the more a new generation of design theory has been successfully patented.