日本尼康NIKON非接觸式三次元

型號：	VMR
品牌：	NIKON
原產地：	日本
類別：	電子、電力 / 儀器、儀表 / 量具、衡器
標籤︰	三次元 , 三座標 , 影像測量儀
單價：	¥400000 / 件
最少訂量：	1 件

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會員信息

詳細信息

崑山茂鑫光電科技有限公司

免費會員上海市黄浦区

即時通訊:

最後上線︰2014/04/17

所有產品信息 (19)

產品描述

Main Unit
Model		VMR-H3030 / H3030 Z120X	VMR-3020 / 3020 Z120X	VMR-6555 / 6555 Z120X	VMR-10080 / 10080 Z120X
Stroke (XxYxZ)		300 x 300 x 150 mm (11.8 x 11.8 x 5.9 in.)	300 x 200 x 150 mm (11.8 x 7.9 x 5.9 in.)	650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.)	1000 x 800 x 150 mm (39.4 x 31.5 x 5.9 in.)
	Optical Head for Type 1, 2, 3
	With max. magnification module (high mag. lens)	300 x 300 x 150 mm (11.8 x 11.8 x 5.9 in.)	300 x 200 x 150 mm (11.8 x 7.9 x 5.9 in.)	650 x 550 x 150 mm (25.6 x 21.7 x 5.9 in.)	1000 x 800 x 150 mm (39.4 x 31.5 x 5.9 in.)
	With max. magnification module (low mag. lens)	250 x 300 x 150 mm (9.8 x 11.8 x 5.9 in.)	250 x 200 x 150 mm (9.8 x 7.9 x 5.9 in.)	600 x 550 x 150 mm (23.6 x 21.7 x 5.9 in.)	950 x 800 x 150 mm (37.4 x 31.5 x 5.9 in.)
Minimum readout		0.01µm	0.1µm
Maximum workpiece weight		30kg (66.1 lb)	20kg (44.0 lb)	30kg (66.1 lb)	40kg (88.2 lb)
Measuring accuracy
	U_1X, U_1Y	0.6 + 2L/1000µm (with a workpiece max. 10kg)	1.5 + 4L/1000µm (with a workpiece max. 5kg)	1.5 + 2.5L/1000µm (with a workpiece max. 30kg)	2 + 4L/1000µm (with a workpiece max. 40kg)
	U_2XY	0.9 + 3L/1000µm (with a workpiece max. 10kg)	2.5 + 4L/1000µm (with a workpiece max. 5kg)	2.5 + 2.5L/1000µm (with a workpiece max. 30kg)	3 + 4L/1000µm (with a workpiece max. 40kg)
Z-axis (L: Length in mm < W.D.)		0.9+L/150µm	1.5+L/150µm
Camera		B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD
Working distance
	Optical Head for Type 1, 2, 3	50mm
	With max. magnification module	High mag. objective lens: 9.8mm Low mag. objective lens: 32mm
Magnification vs field of view
	Optical Head for Type 1	0.5 - 7.5X / 9.33 x 7 - 0.622 x 0.467 mm
	Optical Head for Type 2	1 - 15X / 4.67 x 3.5 - 0.311 x 0.233 mm
	Optical Head for Type 3	2 - 30X / 2.33 x 1.75 - 0.155 x 0.117 mm
	With max. magnification module	1 - 120X / 4.67 x 3.5 - 0.039 x 0.029 mm
Auto focus		TTL Laser AF and Vision AF
Illumination
	Optical Head for Type 1, 2, 3	Diascopic, episcopic, 8-segment LED ring illumination (inner ring / outer ring)
	With max. magnification module	Episcopic, diascopic (with high mag. head only), darkfield illumination
Power source		AC100-240V±10%, 50/60Hz
Power consumption		Max. 11A (Standard type), 13A (Z120X. type)		Max. 13A (Standard type), 15A (Z120X. type)
Dimensions & weigh
	Main unit only	915 x 1060 x 1300 mm, approx. 450kg (36.0 x 41.7 x 51.2 in., 992.1 lb.)	625 x 728 x 1195 mm, approx. 200kg (24.6 x 28.7 x 47.0 in., 441.0 lb.)	-	-
	Main unit & table	1000 x 1100 x 1900 mm, approx. 570kg (39.4 x 43.3 x 74.8 in., 1256.6 lb.)	690 x 730 x 1725 mm, approx. 240kg (27.2 x 28.7 x 67.9 in., 529.1 lb.)	1220 x 1680 x 1750 mm, approx. 600kg (48.0 x 66.1 x 68.9 in., 1322.8 lb.)	1530 x 2200 x 1750 mm, approx. 1500kg (60.2 x 86.6 x 68.9 in., 3306.9 lb.)
	Controller	250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)
Foot print		2400 (W) x 1400 (D) mm (94.5 x 55.1 in.)	2100 (W) x 1100 (D) mm (82.7 x 43.3 in.)	2400 (W) x 2000 (D) mm (94.5 x 78.7 in.)	2800 (W) x 2500 (D) mm (110.2 x 98.4 in.)
Host Computer
Main unit		IBM PC/AT (Windows^®2000)
Monitor		17-in. TFT color

*The "Z120X" type is equivalent to the " Z120X" type in Japan.

Automated Wafer Measuring System VMR3020 + NWL860T
Compatible wafer sizes		ø150mm/200mm (SEMI/JEIDA compliant, silicon)
Standard wafer carriers		Entegris^® 150mm: PA182-60MB, 200mm: 192-80M
Processing speed per carrier (Continuous transfer of 25 wafers)		8 minutes + NEXIV's measurement time
Orientation flat/notch detection		Non-contact, transmitted-type sensor
Wafer transfer/chuck		Vacuum chuck, mechanical transfer
Main unit dimensions (excluding PC rack)		1700 (W) x 960 (D) x 1735 (H) mm (66.9 x 37.8 x 68.3 in.)
Footprint (excluding areas for operation and maintenance)		2750 (W) x 1100 (D) mm (108.3 x 43.3 in.)
Main unit weight		Approx. 370kg (815.7 lb.)
Requirements	Electricity	AC100-240V±10%, 50/60Hz, 11.5A max.
	Vacuum	–800hPa (–600mmHg), 10NI/min.

Wafer Carrier Measuring System NEXIV VMR-C4540
Compatible carriers (FOUP, FOSB, OC)		SEMI-compliant ø300mm wafer carriers 200mm wafer carriers (with dedicated adapter)
Stroke	Measuring head (X x Y x Z)	480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.)
	Rotary table	360° (in 90° increments)
Minimum readout		0.1µm
Head travel speed		XZ axis: max. 200mm/s (7.9 in.) Y axis: max. 50mm/s (2.0 in.)
Kinematic plate rotation speed		90°/2 sec.
Camera		B&W 1/2-in. CCD
Optical magnification		0.27X to 2.74X (5-step 10X zoom)
Field of view		20 x 16 mm to 2.0 x 1.6 mm
Max. workpiece weight		15kg (33.1 lb.)
Measuring accuracy		(10 + 10L/1000)µm, L = measuring length in mm)
Repeatability (2σ)		2µm
Illumination		Episcopic, diascopic, darkfield
Auto focus		Laser AF, Vision AF
Power source		AC100-240V±10%, 50/60Hz
Power consumption (approx.)		AC100-120V: 13A (main unit), 9A (PC) AC200-240V: 7A (main unit), 5A (PC)
Dimensions		1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.)
Weight		Approx. 1400kg (3086.41 lb.)
Host computer		IBM PC/AT (Windows^®2000)