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產品特性（FEATURES）

1. ◆使用Window’s視窗介面，中/英文化書面，操作簡單。
2. ◆手動量測錫膏厚度
3. ◆手動測量長、寬及兩錫膏間之距離（間距）
4. ◆測量值可記錄存檔及列印
5. ◆提供厚度分布統計圖表及X_Bar_R管製表
6. ◆自動計算製程能力指標CP、CPK、CPM
7. ◆可依不同生產線分別作記錄
8. ◆可依基板厚度調整焦距
9. ◆可做定時呼叫取樣
10. ◆All operations are easy and using Windows interface in Chinese/English version.
11. ◆Survey thickness of tin solder by auto matica lly or manually.
12. ◆Survey the length and width manually,and the gap of tin solder.
13. ◆Calculate the measure of area, the measure of cross-section and the measure of volumn automatically.
14. ◆All surveyed values can be recorded to a file and be printed to a report.
15. ◆Provide the diagrams of thickness distribution and control diagrams of X_BAR_R.
16. ◆Calculate man facture ability degree automatically(CP, CPK, CPM)
17. ◆It can have proprietary record according to every different production ling.
18. ◆It can adjust focus point in different thickness of PC boards.
19. ◆It can be called to sample periodically.
    
     

適用（APPLECATION）

1. ◆各式厚度量測數值取得統計分析
2. ◆錫膏印刷機製程品管檢查
3. ◆錫膏印刷厚度良性測量
4. ◆錫膏印刷成型，尺寸量測檢查
5. ◆提供其他物品測厚，測長，量測檢查
6. ◆Get the results of statistics and analysis about all surveyed values in every thickness degree.
7. ◆Inspect the quality of solder printing process.
8. ◆Survey the thickness benignancy of tin solder
9. ◆Measure the dimension of tin solder
10. ◆Provide thickness and dimension measurement function for other objects
    
     

功能（FUNCTION）

1. ◆量測印刷錫膏厚度、長度、高度、間距。
2. ◆提供厚度分布數值參考。
3. ◆提供各種統計分析圖表
    
4.   X管製圖、 R管製圖、厚度列表
     X平均值管製圖 單點列表
5. ◆Surveying the thickness of printing tin solder, length ,height and interval.
6. ◆Provide the references of thickness distribution values.
7. ◆Provide the analysis of different measure of cross-section.
8. ◆Calculate the measure of area and volumn automatically in object which to be surveyed.
9. ◆Provide all diagrams of statistics and analysis.

  Provide X control Diagram, R Control Diagram
  and Thickness List Diagram. Provide X Average
  Control Diagram, Single Point List Diagram.