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1. 單組份導電銀膠one-component conductive silver glue

單一組分，優異的導電性、韌性以及粘結強度，貯存穩定性好，貯存期長，成型工藝：150℃，60min。成型后干膜體積電阻率≤5×10－4Ω·cm。長期使用溫度100℃左右，適用於多種電子元器件間的粘結。

single component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: 150 ℃, 60min. volume resistivity of curing film ≤ 5 × 10-4Ω · cm. Long-term working temperature is about 100 ℃, suitable for the bonding between a variety of electronic components.

2. 雙組份導電銀膠two-component conductive silver glue

A/B組分，優異的導電性、韌性以及粘結強度，貯存穩定性好，貯存期長，成型工藝：室溫，24h或者室溫，30min＋130℃，60min（成型工藝可根據用戶要求現設計），體積電阻率≤5×10－4Ω·cm，粘結強度優異，適合低溫工作環境。

A/B component, excellent conductivity、toughness and bonding strength, stable storage function , long storage time, forming process: room temperature,24h or room temperature,30min+ 130 ℃, 60min(forming process can be designed according to users’ requirements ) . volume resistivity of curing film ≤ 5 × 10-4Ω · cm. excellent bonding strength, suitable for low temperature working environment .

3. 耐高溫導電銀膠high temperature conductive silver glue

單一組分，長期耐溫≤250℃，具有優異的導電性以及粘結強度，對大多數材料的粘結強度高，特別是對金屬材料的粘結力好，施工性好，主要用於長期高溫環境下使用的電子元器件的粘結，貯存期長。

Single component, long-term working temperature ≤ 250 ℃, excellent conductivity and bonding strength, high bonding strength with most materials especially metallic materials, good construction, mainly used for bonding between electronic components in long-term high temperature environment, long storage time.