產品描述
Features
- Unique pressure and temperature uniformity
- Compatible with EVG mechanical and optical aligners
- Flexible design and configurations for research and piloting
- Form single chips to wafers
- Various processes (eutectic, solder, TLP, direct bonding)
- Optional turbopump (<1E-5 mbar)
- Upgradeable for anodic bonding
- Open chamber design for easy conversion and maintenance
- Production compatible
- High throughput with fast heating and pumping specifications
- High yield through automatic wedge compensation
- Open chamber design for fast conversion and maintenance
- Smallest footprint for a 200 mm bonding system: 0.8 m2
- Recipes are fully compatible with EVG’s high-volume-manufacturing bonding systems
Technical Data
| Max contact force |
| 10, 20, 60 kN |
| Heater size |
150 mm |
200 mm |
| Minimum substrate dimension |
single chips |
100 mm |
| Vacuum |
| Standard: 0.1 mbar |
| Optional: 1E-5 mbar |
| Max. temperature |
| Standard: 550 °C |
| Optional: 650 °C |
| Single chips processing |
| Yes |
| Bond chuck system / Alignment system |
| 150 mm heater: EVG®610, EVG®620, EVG®6200 |
| 200 mm heater: EVG®6200, SmartView® NT |
| Active water cooling |
| For bottom side |
| Power supply for anodic bonding |
| Max. voltage: 2 kV |
| Max. current: 50 mA |
產品圖片
圖 1
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